| 3DIC 2027 | |
| IEEE International 3D Systems Integration Conference (3DIC) Dates: TBD Venue: TBD, TBD, TBD | ||
| Please note ! All dates are subject to changes. | ||
| The IEEE 3DIC Conference will cover all 3D system integration topics, including 3D/Chiplet process technology, materials, equipment, circuits technology, design methodology, and applications.
Website: https://3dic-conf.org/ |
| Organizers | |||
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IEEE Electronics Packaging Society | ||
| Piscataway, Piscataway United States Tel: +1-732-null https://eps.ieee.org/ | |||
| PC Version | About Us | |
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