| ICEPT 2026 | 205 days |
| 27th International Conference on Electronic Packaging Technology (ICEPT) 8/5/2026 - 8/7/2026 Venue: Xi'an, Xian, China | ||
| Please note ! All dates are subject to changes. | ||
| The International Conference on Electronic Packaging Technology (ICEPT) is one of the largest and most cohesive packaging technology conference in Asia. 2026 27th International Conference on Electronic Packaging Technology (ICEPT) will be held in Xi'an, China, from August 5th to 7th, 2026.
The conference is hosted by Institute of microelectronics, Chinese Academy of Sciences, Xi'an Jiaotong University, IEEE-EPS and CIE-EMPT. It is organized by the School of Microelectronics of Xi'an Jiaotong University, National Center for Advanced Packaging Co., Ltd., Shaanxi Semiconductor Industry Association and Beijing Herogees Consulting Company. ICEPT held in China every year, conference topics including Packaging Design, Manufacturing Technologies, R&D, and Photonics, MEMS, System Integrated Packaging etc..., since it inaugurated in 1994, ICEPT has been held by Tsinghua University, Peking University, Fudan University, Harbin Institute of Technology, Huazhong University of Science and Technology, Hong Kong University of Science and Technology and other universities for 26 sessions. ICEPT attracts a large number of domestic and foreign universities, research institutions, electronic packaging manufacturers participate, more than 800 Well known experts, scholars and business people from about 20 countries and regions are expeccted to attend ICEPT 2026. Website: http://www.icept.org/ |
| Organizers | |||
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IEEE Electronics Packaging Society | ||
| Piscataway, Piscataway United States Tel: +1-732-null https://eps.ieee.org/ | |||
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