ICEP-HBS 2026	134 days
	International Conference on Electronic Packaging & Hybrid Bonding Symposium 4/14/2026 - 4/18/2026 Venue: International Conference Center Hiroshima, Hiroshima, Japan
Please note ! All dates are subject to changes.

ICEP is the largest international conference on electronic packaging in Japan, attracting more than 900 attendees and hosting about 35 technical sessions. ICEP provides a strong platform to demonstrate your technologies and products as well as expand your customer network. It is jointly sponsored by JIEP, IEEE EPS, IEEEEPS Japan Chapter, iMAPS, and SMTA. The conference has technical sessions covering a wide range of topics including advanced packaging, design, modeling and reliability, emerging technologies, high-speed, wireless & components, interconnections, materials and processes, optoelectronics, power electronics integration, and thermal management. Since its inauguration in 2001, ICEP has developed into a highly reputed electronics packaging conference in Japan, attended by world-renowned experts in all aspects related to packaging technologies from all over the world. Website: https://www.jiep.or.jp/icep/

Venues
	International Conference Center Hiroshima
	1-5, Nakajima-cho, Naka-ku, Hiroshima Japan Tel: +82-242-7777 http://www.pcf.city.hiroshima.jp/

Organizers
	Japan Institute of Electronics packaging (JIEP)
	3-12-2 Nishiogikita, Suginami-ku, Tokyo 167-0042, Tokyo Japan Tel: +81-03-5310-2010 https://www.jiep.or.jp/

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