CICMT 2026 | ||
IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies Dates: TBD Venue: TBD, TBD, TBD | ||
Please note ! All dates are subject to changes. | ||
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in the technical program. The Ceramic Interconnect focuses on cost effective and reliable high-performance ceramic interconnect products for extreme environments in the automotive, aerospace, lighting, solar, and communication industries. The Ceramic Microsystems focus is on emerging applications and new products that exploit the ability of 3D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Multilayer ceramic, thin film, tape casting, thick film hybrid, direct write, and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design, and application opportunities.
Website: https://imaps.org/ |
Organizers | |||
IMAPS - International Microelectronics Assembly and Packaging Society | |||
100 Park Drive, Suite 102 (Office) Research Triangle Park, NC 27709-5127, Durham United States Tel: +1-919-293-5000 http://www.imaps.org/ | |||
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