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The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society's portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 3,000 members in the United States and more than 3,000 international members around the world.
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IMAPS Device Packaging 2025
21st Annual Device Packaging Conference (DPC 2025)
3/3/2025 - 3/6/2025
CICMT 2025
International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
Dates: TBD
CHIPcon 2025
Inaugural Conference and Exhibition on System in Package (SiP) Technology
Dates: TBD
IMAPS 2025
58th International Symposium on Microelectronics
Dates: TBD
Device Packaging 2026
22nd International Conference on Device Packaging
Dates: TBD



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