IMAPS Device Packaging 2025	67 days
	21st Annual Device Packaging Conference (DPC 2025) 3/3/2025 - 3/6/2025 Venue: Sheraton Grand at Wild Horse Pass, Phoenix AZ, United States
Please note ! All dates are subject to changes.

The 21st Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6, 2025. It is an international event organized by the International Microelectronics Assembly and Packaging Society and a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals. The 2025 conference will feature 4 keynote presentations, technical sessions on Heterogeneous: 2D and 3D Integration/Emerging Technologies/Fan-Out, Wafer/Panel Level & Flip Chip Packaging, an embedded Global Business Council Plenary Session, an interactive poster session, an evening panel discussion, and more. Website: https://imaps.org/page/DPC2025

Venues
	Sheraton Grand at Wild Horse Pass
	5594 W Wild Horse Pass Blvd, Phoenix, AZ 85226, Phoenix AZ United States Tel: +1-602-225-0100 https://www.marriott.com/en-us/hotels/phxwp-sheraton-grand-at-wild-horse-pass/overview/

Organizers
	IMAPS - International Microelectronics Assembly and Packaging Society
	100 Park Drive, Suite 102 (Office) Research Triangle Park, NC 27709-5127, Durham United States Tel: +1-919-293-5000 http://www.imaps.org/

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