| IMAPS Device Packaging 2027 | |
| 23rd International Conference on Device Packaging Dates: TBD Venue: Phoenix AZ, Phoenix AZ, United States | ||
| Please note ! All dates are subject to changes. | ||
| The Annual Device Packaging Conference (DPC) is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals. Website: https://imaps.org/page/device-packaging-conference |
| Organizers | |||
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IMAPS - International Microelectronics Assembly and Packaging Society | ||
| 100 Park Drive, Suite 102 (Office) Research Triangle Park, NC 27709-5127, Durham United States Tel: +1-919-293-5000 http://www.imaps.org/ | |||
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