| IMAPS APPE/CICMT/HiTEC 2025 | 110 days |
| IMAPS APPE/CICMT/HiTEC Conference & Exhibition 4/14/2025 - 4/17/2025 Venue: Hotel Albuquerque at Old Town, Albuquerque NM, United States | ||
| Please note ! All dates are subject to changes. | ||
| Our High Temperature, CICMT, and Power Packaging Conferences come together for a great opportunity for you.....one location, one registration, and three times the content, networking, and learning! The 2025 conference will feature combined plenary and keynote presentations, along with specific technical afternoon sessions.
The International Conference on Advanced Packaging for Power Electronics (APPE) will bring together technologists from a diverse collection of disciplines in power semiconductor packaging, application development, reliability, modeling, process development, thermal management, and advanced materials/manufacturing to support the next generation of power electronics development. Attendees and Exhibitors will be exposed to a variety of power applications and packaging solutions from board level integration to power packaging for distributed energy systems to encourage cross pollination and insight of current and emerging market challenges and opportunities for collaboration. The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a multi-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high-performance ceramic interconnect products for extreme environments in the automotive, aerospace, lighting, solar, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Multilayer ceramic, thin film, tape casting, thick film hybrid, direct write, and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design, and application opportunities. HiTEC 2025 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics Assembly and Packaging Society, HiTEC 2025 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics. Website: https://imaps.org/page/APPE_CICMT_HITEC2025 |
| Venues | |||
 |
Hotel Albuquerque at Old Town | ||
| 800 Rio Grande Blvd. NW, Albuquerque, New Mexico 87104, Albuquerque NM United States Tel: +1-866-505-7829 https://www.hotelabq.com/ | |||
| Organizers | |||
 |
IMAPS - International Microelectronics Assembly and Packaging Society | ||
| 100 Park Drive, Suite 102 (Office) Research Triangle Park, NC 27709-5127, Durham United States Tel: +1-919-293-5000 http://www.imaps.org/ | |||
| PC Version | About Us | |
Showseye - Global Professional Events
| ||