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The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society's portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 3,000 members in the United States and more than 3,000 international members around the world.
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Wire Bonding 2025
Wire Bonding 2025 Workshop and Tabletop Exhibition
2/3/2025 - 2/4/2025
IMAPS Device Packaging 2025
21st Annual Device Packaging Conference (DPC 2025)
3/3/2025 - 3/6/2025
IMAPS Medical Microelectronics 2025
IMAPS Advanced Packaging for Medical Microelectronics Workshop
3/5/2025 - 3/7/2025
IMAPS APPE/CICMT/HiTEC 2025
IMAPS APPE/CICMT/HiTEC Conference & Exhibition
4/14/2025 - 4/17/2025
IMAPS/IPC Onshoring Workshop 2025
IMAPS/IPC Workshop for On-Shoring Advanced Packaging and Assembly
4/28/2025 - 5/1/2025



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