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The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society's portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 3,000 members in the United States and more than 3,000 international members around the world.
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IMAPS Memory Summit 2026
Memory Access for AI Inference at Scale
5/14/2026 - 5/16/2026
Electronics for Extreme Environments 2026
IMAPS Electronics for Extreme Environments Conference
6/30/2026 - 7/1/2026
IMAPS CHIPcon 2026
From Chiplets to System: Architecting the Future of Advanced Integration
7/6/2026 - 7/9/2026
IMAPS Symposium 2026
59th International Symposium on Microelectronics
9/28/2026 - 10/1/2026
Si Photonics Packaging Summit 2026
Si Photonics Packaging Summit
10/1/2026 - 10/2/2026



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